Electrostatic chucks are critical wafer holders for lithography, etching, deposition and inspection equipment. Wafers are fixed by electrostatic force with stress-free full contact to ensure process uniformity for 12-inch mass production, including Coulomb and J-R types.
1. Dual high-precision bipolar DC high voltage creates strong electrostatic field for stable wafer adsorption;
2. Linear voltage adjustment adapts to different wafer thickness and materials;
3. High-sensitivity leakage current monitoring enables closed-loop process control.
Dual independent adjustable outputs, voltage accuracy ≤0.1%, ultra-low ripple, μA leakage monitoring and microsecond protection for large-size 12-inch wafers.
Bipolar high voltage generates electrostatic force between dielectric layer and wafer to maintain stable contact during high-speed rotation, plasma bombardment and high-temperature processes without wafer warpage.
Lithography machines, etching tools, PVD / PECVD deposition, wafer probe stations and inspection systems.
