Scanning Electron Microscopes provide nanoscale surface imaging for microstructure analysis, wafer defect review and chip failure analysis by focused electron beams detecting secondary and backscattered electrons in semiconductor, material and biological research.
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X-ray systems support semiconductor material characterization and non-destructive testing, including XRD crystal analysis, XRF composition measurement, industrial CT internal defect scanning and X-ray thickness gauging for thin-film metrology.
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PMT and MCP realize ultra-sensitive single-photon and single-ion detection, widely used in wafer defect inspection, SIMS, environmental chromatography, radiation monitoring, fluorescence analysis and biomedical testing with signal magnification up to 10⁶~10⁸ times.
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It is the core reliability test before delivery for discrete semiconductors and ICs, including withstand voltage, breakdown, HTRB, avalanche resistance and leakage current tests to screen defective devices and ensure quality for IGBT, MOSFET, diodes, optocouplers and integrated circuits.
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