Vacuum plasma treatment performs ultra-clean surface processing including cleaning, activation, etching and resist stripping for semiconductors, medical parts and optical components without residue or damage.
1. RF pulse high voltage generates low-pressure high-activity plasma;
2. Precise energy control ensures damage-free processing;
3. Stable discharge supports batch and inline vacuum processing equipment.
Stable low-pressure discharge, high reactivity, wide power adjustment and multi-chamber synchronous control.
Vacuum plasma uses chemical radicals and physical ion bombardment to achieve ultra-precise cleaning, activation and stripping for high-end manufacturing.
Wafer resist stripping, medical ultra-fine cleaning, optical pre-coating treatment, aerospace parts and MEMS packaging.
