Modular and reconfigurable design serves as the core technical pathway to realize the standardization, serialization and rapid customization of general high‑voltage power supplies. It fundamentally solves the longstanding pain points of traditional high‑voltage power supplies, such as high customization dependency, lengthy R&D cycles, poor consistency in mass production, and difficult maintenance. Through combinations of standardized modular units, products with different voltage levels, power ratings and functional requirements can be quickly adapted, covering high‑voltage demands across industries including industrial, medical, environmental protection, new energy and scientific research. It provides critical technical support for the large‑scale and standardized development of domestic high‑voltage power supplies. The design of modular and reconfigurable architectures for general high‑voltage power supplies faces eight core technical challenges.
First, the challenge of module universality and compatibility. High‑voltage requirements vary greatly across industries and scenarios, with voltage levels ranging from hundreds of volts to thousands of kilovolts, power levels from several watts to tens of megawatts, and topologies including linear, switching, resonant and pulsed types. Modules must deliver strong universality and adaptability to support the full range of voltage, power and topology demands through flexible combinations. Second, the challenge of electrical isolation and electromagnetic compatibility between modules. Extremely high potential differences exist among modules, especially in series boosting structures where isolation withstand voltage may reach tens or even hundreds of kilovolts. Mutual electromagnetic coupling degrades overall EMI performance and control stability, requiring superior insulation withstand capability and optimized EMC design for each module. Third, the challenge of flexibility and stability in reconfigurable topologies. Reconfigurable architectures allow series, parallel and hybrid connections to reconstruct topologies such as flyback, forward, full‑bridge, LLC and Marx. Modules must adopt standardized power, control and communication interfaces while maintaining stable system operation after reconfiguration without voltage imbalance, current imbalance or oscillation. Fourth, the challenge of standardized interfaces and communication protocols. Reliable power, control, communication and auxiliary power connections are essential across modules. Unified mechanical, electrical and communication standards ensure interchangeability among modules from different manufacturers and batches to achieve true generalization. Fifth, the challenge of voltage balancing control in multi‑module series connections. High‑voltage outputs are realized by stacking multiple modules in series. Parameter deviations and load variations cause uneven voltage distribution and potential overvoltage damage. Precise voltage balancing control with accuracy ≤±2% is required to guarantee stable series operation. Sixth, the challenge of current sharing control in multi‑module parallel connections. High‑power outputs rely on parallel modules. Differences in parameters and driving delays lead to current imbalance and overcurrent risks. Advanced current sharing with accuracy ≤±2% ensures reliable parallel system performance. Seventh, the challenge of thermal design and reliability. Modular high‑voltage power supplies feature high integration and high power density, increasing thermal complexity. Standardized thermal solutions ensure effective heat dissipation under all combinations, limiting junction temperatures within rated values while achieving an MTBF ≥2×10⁵ hours for long‑term stable operation. Eighth, the challenge of system‑level redundancy and fault tolerance. N+1 redundancy is required to automatically isolate faulty modules without shutdown, enabling maintenance during continuous operation. Modules must support hot swapping, self‑diagnosis and automatic isolation to ensure high availability.
Addressing these core challenges, this methodology establishes a universal framework of “standardized power module units + layered reconfigurable architecture + distributed cooperative control system”. By series, parallel and hybrid combinations, high‑voltage power supplies with diverse topologies, voltages and power levels can be rapidly reconstructed, breaking through traditional limitations of heavy customization, long cycles and poor universality. The design follows eight core principles. First, standardized power module units adopt a dual‑core structure of “power core + control core”. The power core integrates power switches, high‑frequency transformers, rectifiers, filters and drivers, categorized into low‑voltage low‑power, medium‑voltage medium‑power and high‑voltage high‑power series. Single modules cover 1 kV~50 kV output voltage and 10 W~100 kW output power with unified electrical, control, communication and mechanical interfaces for full interchangeability. Fully encapsulated construction ensures insulation withstand voltage ≥ twice the rated output with excellent anti‑interference performance. Second, a three‑layer reconfigurable architecture — module level, unit level and system level — enables flexible expansion. Basic modules operate independently or combine into high‑voltage/high‑power units reaching 10 kV~1000 kV or 100 kW~10 MW. Multiple units form complete systems reconfigurable into linear regulation, switching regulation, resonant conversion or pulsed discharge modes to suit diverse applications. Standardized interfaces allow rapid reconstruction without modifying core hardware or software, greatly shortening development cycles. Third, unified mechanical, electrical and communication standards ensure compatibility. Standard guide rail and flange mounting enable fast installation; high‑voltage aviation connectors feature anti‑insertion and anti‑arc protection; communication interfaces including RS485, CAN and optical fiber adopt Modbus‑RTU and CANopen protocols for seamless interconnection and cooperative control. Fourth, dual voltage balancing control for series connections combines master–slave management with distributed algorithms. Each module features independent voltage regulation synchronized via optical fiber to maintain voltage deviation ≤±2%. Passive hardware balancing guarantees safety even with communication interruptions. For Marx pulsed topologies, nanosecond synchronous triggering ensures perfectly synchronized switching for precise pulse output. Fifth, dual current sharing control for parallel connections integrates droop control with active current balancing, supporting master–slave, autonomous and distributed modes with current sharing accuracy ≤±2%. Real‑time load current sharing enables dynamic output adjustment, while redundant mechanisms automatically remove faulty modules and redistribute loads without interruption. Sixth, full isolation and EMC optimization adopt fully shielded metal enclosures with shielding effectiveness ≥60 dB. Optical isolation between modules achieves ≥50 kVAC withstand voltage to block high‑voltage coupling and interference. Three‑stage EMI filtering suppresses conducted noise; optimized internal layout separates power and control loops to minimize high‑frequency radiation. Equipotential shielding improves electric field distribution to avoid partial corona discharge and insulation breakdown. Seventh, hot‑swap and redundant fault tolerance enable module replacement during continuous operation with dedicated protection circuits against voltage surges, arcing and short circuits during swapping. N+1 or M+N redundancy isolates faults within 1 μs with seamless load transfer, ensuring uninterrupted output. Built‑in self‑diagnosis accurately identifies fault types for fast troubleshooting. Eighth, standardized thermal and reliability design provides natural cooling, air cooling and water cooling options with unified heat sink interfaces optimized via finite element thermal simulation. Even power device distribution maintains junction temperatures below 70% of rated limits under maximum ambient conditions. Strict component derating reduces electrical stress; industrial‑grade long‑lifetime components ensure module MTBF ≥2×10⁵ hours and design life ≥15 years. Integrated health monitoring tracks operating status, temperatures and cumulative runtime to support predictive maintenance.